DuPont Microcircuit Materials Launches New Generation Frontside Silver Photovoltaic Metallizations

Solamet® PV17x Series Helps Set New Standard for Solar Cell Efficiency

RESEARCH TRIANGLE PARK, N.C., Feb. 22, 2011- DuPont Microcircuit Materials (MCM) is introducing a new series of frontside silver photovoltaic metallization pastes using new and novel chemistry formulated to deliver advanced efficiency and adhesion for solar cells. DuPont™ Solamet® PV17x series photovoltaic metallizations also will enable higher process reliability and yield for both cell and module manufacturers. The performance of DuPont™ Solamet® PV17A metallization paste, the first in the series, surpasses that of the Solamet® PV16A series, which set the standard in the industry for conversion efficiency when it was introduced less than nine months ago. Compatible with high-speed printing processes, and featuring improved contact and grid resistance, Solamet® PV17x series are the latest in a broad and quickly expanding portfolio of new Solamet® offerings DuPont has developed to help enable the solar industry goal for conversion efficiency of crystalline silicon (c-Si) solar cells beyond 20 percent in 2012.

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DuPont™ Solamet® PV17A photovoltaic metallization is setting a new standard for frontside silver efficiency
"Within a very short timeframe, DuPont has developed and tested new patented chemistry for Solamet® PV17A photovoltaic metallization paste which exceeds the conversion efficiency of Solamet® PV16A using less material," said Peter Brenner, global marketing manager, photovoltaics - DuPont Microcircuit Materials. "Because we have the industry experience, the scientific expertise, the vision and the drive, we are able to consistently provide unique, high-quality and cost-effective solutions such as Solamet® PV17A to our customers."
Solamet® PV17A delivers up to 0.2 percent improved efficiency over PV16A, enabled through improved series resistance, and achieves results more cost-effectively, because it requires 10 percent lower material consumption. Cell manufacturers can expect to achieve 70 to 80 micron finger openings at high print speeds. Solamet® PV17A exhibits exceptional solderability and adhesion which enables reliable use in the highly automated tabbing and stringing processes used by module makers.
Two additional Solamet® products have been rolled out this year enabling material advances in efficiency: Solamet® PV701 for Metal Wrap Through, and Solamet® PV36x series for Local Back Surface Field solar cell designs. MCM continues to advance photovoltaic metallization technology according to the roadmap of proposed technology options to help enable the industry goal for conversion efficiency of c-Si solar cells beyond 20 percent in 2012.
DuPont MCM has over 40 years of experience in the development, manufacture, sale and support of specialized thick film compositions for a wide variety of electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military and telecommunications markets. For more information on DuPont Microcircuit Materials and Solamet®metallization pastes, please visit http://mcm.dupont.com.
DuPont™ Solamet® photovoltaic metallizations are part of a broad and growing portfolio of products represented by DuPont Photovoltaic Solutions (DPVS), which connects science and technology from across the company on a global scale to help support the dramatic growth in the photovoltaic industry. To learn more, please visit http://photovoltaics.dupont.com.
DuPont (www.dupont.com) is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 90 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.

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