2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Quality assurance in the manufacturing industry
Efficiency and precision with CSP software. In the highly competitive world of manufacturing, quality assurance is a critical factor for success. CSP offers you state-of-the-art software solutions specifically designed to ensure the highest standards of quality assurance in the manufacturing industry.
