2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
MORNINGSTAR - ReadyEdge
The ReadyEdgeTM (RE-1) accessory is an intelligent system controlling and reporting device meant to make monitoring your solar energy system more transparent. Enabling access to LiveViewTM 2.0 and Morningstar Solar ConnectTM, ReadyEdge provides data from all compatible Morningstar devices in your system. It is designed to be paired with the three ReadyBlock options, up to six total, with the possibility to use multiple ReadyShunts and ReadyRelays. The ReadyEdge is compatible with select Morningstar products.
