Pilot Installation of BIPV

THORNTON, Colo.--Ascent Solar Technologies, Inc. (NASDAQ:ASTI), a developer of state-of-the-art, flexible thin-film photovoltaic modules, announced today that it has been selected to provide BIPV solar modules in a pilot application at Foxconn's new factory in Zhenzhou City, Henan Province, China. Foxconn is the world's largest maker of electronic devices and produces many products including the iPad®, iPhone®, Kindle®, Playstation® and Xbox®.

Ascent's modules' flexible and lightweight form factor allows the modules to be integrated seamlessly into the building structure in ways traditional glass-back photo-voltaic technology cannot. The integration of the modules will allow the factory to utilize cost-effective, high-performance solar power utilizing Ascent's industry leading CIGS technology to deliver the highest power density available on thin-film plastic substrates.

Ascent Solar's President and CEO, Victor Lee, said, "We are honored to be selected by Foxconn to provide our lightweight, durable, flexible thin-film solar modules in this new factory. We plan to demonstrate the value of our technology and we hope to build a long term relationship with Foxconn."

About Ascent Solar Technologies:

Ascent Solar Technologies, Inc. is a developer of thin-film photovoltaic modules using flexible substrate materials that can transform the way solar power generation integrates into everyday life. Ascent Solar modules can be directly integrated into standard building materials, commercial transportation, automotive solutions, space applications, consumer electronics for portable power and durable off-grid solutions. Additional information can be found at www.ascentsolar.com.